Placa Base Gigabyte H610M K DDR4 Socket 1700/ Micro ATX

Z790 AORUS ELITE AX

• Intel® Socket LGA 1700: compatible con procesadores de las series 14ª, 13.ª y 12.ª generación
• Rendimiento incomparable: solución VRM digital de 16*+2+１ fases gemelas
• DDR5 de doble canal: 4 * DIMM SMD con soporte para módulo de memoria XMP 3.0
• Almacenamiento de próxima generación: 4 * conectores PCIe 4.0 x4 M.2
• Diseño térmico avanzado y M.2 Thermal Guard III: para garantizar la estabilidad de energía de VRM y el rendimiento de SSD M.2
• EZ-Latch Plus: Conectores M.2 con liberación rápida y diseño sin tornillos
• Redes rápidas: LAN de 2,5 GbE y Wi-Fi 6E 802.11ax
• Conectividad extendida: DP, HDMI, USB- C® frontal de 10 Gb/s, USB-C® posterior de 20 Gb/s
• Smart Fan 6: cuenta con múltiples sensores de temperatura y cabezales de ventilador híbridos con FAN STOP
• Q-Flash Plus: actualice el BIOS sin instalar la CPU, la memoria y la tarjeta gráfica

ACTUACIÓN

Para garantizar el máximo Turbo Boost y rendimiento de overclocking de la CPU de nueva generación de Intel, las placas base de la serie AORUS de GIGABYTE equipan el mejor diseño de VRM jamás creado con componentes de la más alta calidad.

TÉRMICO

M.2 Guardia Térmica III

M.2 Thermal Guard III construido con una superficie de disipación de calor optimizada 6X y disipadores de calor M.2 de doble cara para evitar estrangulamiento y cuellos de botella en SSD M.2 de alta velocidad y gran capacidad.

Guardia térmica ampliada

El disipador de calor M.2 ampliado evita que la memoria flash de las SSD PCIe 4.0/3.0 de gran capacidad y alta velocidad se acelere debido al sobrecalentamiento.

Diseño térmico completamente cubierto

MOSFET de alta cobertura y disipadores de calor moldeados integrados para mejorar la eficiencia térmica con un mejor flujo de aire e intercambio de calor.

Tubo de calor de 6 mm

Almohadilla térmica de 7,5 W/mK

PCB de cobre de 6 capas y 2X

El diseño de PCB de cobre 2X reduce efectivamente la temperatura del componente debido a su alta conductividad térmica y baja impedancia.

Especificaciones

• Procesador
• LGA1700 socket: Support for the 14th 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
• L3 cache varies with CPU
• Chipset
  
• Intel® Z790 Express Chipset
• Memoria
• Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 memory modules
• 4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory
• Dual channel memory architecture
• Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
• Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
• Support for Extreme Memory Profile (XMP) memory modules
• Gráfica Integrada
  
• Integrated Graphics Processor-Intel® HD Graphics support:
• 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
• * Support for HDMI 2.0 version and HDCP 2.3.
• 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60
• * Support for DisplayPort 1.2 version and HDCP 2.3
• (Graphics specifications may vary depending on CPU support.)
• Audio
• Realtek® Audio CODEC
• High Definition Audio
• 2/4/5.1/7.1-channel
• * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
• Support for S/PDIF Out
• LAN
• Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
• Módulo de comunicaciones inalámbricas
• Intel® Wi-Fi 6E AX211 (For PCB rev. 1.0 / 1.1)
• WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
• BLUETOOTH 5.3
• Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
• Realtek® Wi-Fi 6E RTL8852CE (For PCB rev. 1.2)
• WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
• BLUETOOTH 5.3
• Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
• * Actual data rate may vary depending on environment and equipment.
• Zócalos de Expansión
• CPU:
• 1 x PCI Express x16 slot, supporting PCIe 5.0 and running at x16 (PCIEX16)
• * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
• Chipset:
• 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4_1)
• 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4_2)
• Interfaz de almacenamiento
• CPU:
• 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
• Chipset:
• 2 x M.2 connectors (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB, M2Q_SB)
• 1 x M.2 connector (Socket 3, M key, type 22110/2280 SATA and PCIe 4.0 x4 SSD support) (M2M_SB)
• 6 x SATA 6Gb/s connectors
• RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices
• RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
• * Refer to '2-8 Internal Connectors,' for the installation notices for the M.2 and SATA connectors.
• USB
• Chipset:
• 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2x2 support
• 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header
• 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
• 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
• Chipset+2 USB 2.0 Hubs:
• 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
• Conectores Internos E/S
• 1 x 24-pin ATX main power connector
• 2 x 8-pin ATX 12V power connectors
• 1 x CPU fan header
• 1 x water cooling CPU fan header
• 3 x system fan headers
• 1 x system fan/water cooling pump header
• 2 x addressable LED strip headers
• 2 x RGB LED strip headers
• 4 x M.2 Socket 3 connectors
• 6 x SATA 6Gb/s connectors
• 1 x front panel header
• 1 x front panel audio header
• 1 x USB Type-C® header, with USB 3.2 Gen 2 support
• 1 x USB 3.2 Gen 1 header
• 2 x USB 2.0/1.1 headers
• 2 x Thunderbolt™ add-in card connectors
• 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
• 1 x reset button
• 1 x Q-Flash Plus button
• 1 x Clear CMOS button
• 1 x reset jumper
• 1 x Clear CMOS jumper
• Panel E/S Trasero
• 1 x USB Type-C® port, with USB 3.2 Gen 2x2 support
• 2 x USB 3.2 Gen 2 Type-A ports (red)
• 3 x USB 3.2 Gen 1 ports
• 4 x USB 2.0/1.1 ports
• 2 x SMA antenna connectors (2T2R)
• 1 x HDMI 2.0 port
• 1 x DisplayPort
• 1 x RJ-45 port
• 1 x optical S/PDIF Out connector
• 2 x audio jacks
• Controlador E/S
• iTE® I/O Controller Chip
• Monitorización Hardware
• Voltage detection
• Temperature detection
• Fan speed detection
• Water cooling flow rate detection
• Fan fail warning
• Fan speed control
• * Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.
• BIOS
• 1 x 256 Mbit flash
• Use of licensed AMI UEFI BIOS
• PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
• Otras Características
• Support for GIGABYTE Control Center (GCC)
• Support for Q-Flash
  
• Support for Q-Flash Plus
• Support for Smart Backup
• Bundled Software
• Norton® Internet Security (OEM version)
• LAN bandwidth management software
• Sistema Operativo
• Support for Windows 11 64-bit
• Support for Windows 10 64-bit
• Formato
• ATX Form Factor; 30.5cm x 24.4cm

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